Copper has excellent physcial, thermal properties and electrical conductivity. Copper is easily soldered, welded and plated for corrosion resistance.
Gold plated pure copper is used when electrical condutivity is crucial and its application is critical to maintaining a stable resistance with minimal variation over the wire length.
Copper is available in three grades of Oxygen free (OF), Oxygen free electronic (OFE) and also in grade Electrolytic tough pitch (ETP), in both round and milled ribbon forms.
Chemical composition
|
Cu % |
Ag% |
| Nominal composition |
99.99 |
min |
Mechanical properties
|
Tensile strength
Rm |
|
MPa |
ksi |
| Hard |
455 |
66 |
| Anealed |
240 |
35 |
Physical properties
| Density g/cm3 (lb/in3) |
8.89 (0.321) |
| Electrical resistivity at 20°C Ωmm2/m (Ω circ. mil/ft) |
0.017 (10.2) |
| Temperature coefficient of resistance K-1 |
+0.00393 to +0.00397 |
| Conductivity at 20°C (68°F) |
Annealed, 100% to 101.5% IACS min |
Coefficient of thermal expansion
| Temperature °C (°F) |
Thermal expansion 10 -6/K (10-6 /°F) |
| 20-500 (68-932) |
17.0 (9.4) |
Thermal conductivity
| Temperature °C (°F) |
100 (212) |
| W m-1 K-1 (Btu h-1ft-1°F-1) |
388 (224) |
Specific heat capacity
| Temperature °C (°F) |
20 |
| kJ kg-1 K-1 (Btu lb-1 °F-1) |
0.385 (0.09) |
| Melting Point °C (°F) |
1083 (1981) |
Standards
| Specifications |
ASTM B 1, 2, 3, 250 |
