Fibrothal® heating elements

In semiconductor manufacturing, maintaining temperature uniformity is crucial for achieving desired process results. The effectiveness of thermal processes depends heavily on the heat source used. Our Fibrothal® heating elements, available in both light- and heavy-gauge options, can be customized to meet specific requirements.

Light-gauge heating elements offer essential temperature control and precise response for LPCVD processes. Heavy-gauge heating elements deliver consistent and reliable heat for a variety of higher-temperature Atmospheric processes. By combining light- and heavy-gauge elements in both horizontal and vertical furnaces, Fibrothal® heating elements significantly enhance performance and reliability in semiconductor manufacturing.

Previously supplied under the MRL and Sandvik Materials Technology brands, our Fibrothal® heating elements are also known as Aztec, Helix, Black Max, or Magna SW in North America and White John in Europe.

Light gauge heating elements

Light-gauge heating elements are made from thin wire formed into sinusoidal patterns or spring-like coils. The term “light gauge” refers to the use of smaller-diameter wire in their construction. This design supports uniform temperature profiles and stable thermal conditions during LPCVD processes.

Read more

Heavy gauge heating elements

Heavy-gauge heating elements are made from thicker resistance wire, formed into a cylindrical shape, then insulated and encased. They can be designed with multiple heating zones and are built to deliver consistent, reliable heating across a range of applications. The coils are also manufactured with precise inner diameter accuracy.

Read more

Horizontal and vertical heating elements

The choice between horizontal and vertical furnaces depends on various factors, including the specific semiconductor manufacturing processes being employed and the goals of the fabrication facility. Each orientation has its advantages and disadvantages, and the selection may be influenced by factors such as wafer size, process requirements, and the overall manufacturing workflow.

Read more

Relevant documents

Data sheets