Horizontal and vertical heating elements
Fibrothal® heating elements, available in light and heavy gauges, are designed and oriented horizontally or vertically depending on their intended use.
The choice between horizontal and vertical furnaces depends on various factors, including the specific semiconductor manufacturing processes being employed and the goals of the fabrication facility. Selection may be influenced by factors such as wafer size, process requirements, and the overall manufacturing workflow.
In practice, both horizontal and vertical furnaces are used in semiconductor manufacturing, and the choice depends on the specific needs and constraints of the manufacturing process. Each orientation has its own set of applications, and manufacturers may use a combination of both types of furnaces in their production facilities.
Information
Horizontal and vertical Furnaces
- ≤ 300 mm wafer substrates
- Atmospheric Process temperatures can be 600 to 1,350°C (1,112 to 2,462 °F).
- LPCVD process temperatures can be 300 to 1,000°C (572 to 1,832°F).
- Multiple zone configurations available
- Also known as Aztec, Helix, Black Max, or Magna SW
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