Copper has excellent physical, thermal properties and electrical conductivity. Copper is easily soldered, welded and plated for corrosion resistance.
Gold plated pure copper is used when electrical conductivity is crucial and its application is critical to maintaining a stable resistance with minimal variation over the wire length.
Copper is available in three grades of Oxygen free (OF), Oxygen free electronic (OFE) and also in grade Electrolytic Tough Pitch (ETP), in both round and milled ribbon forms.
|Cu %||Ag %|
Oxygen free electronic
Table represents nominal composition of each grade
|Density g/cm3 (lb/in3)||8.94 (.323)|
|Electrical resistivity at 20°C Ωmm2/m (Ω circ. mil/ft)||0.017 (10.2)|
|Temperature coefficient of resistance K-1||+0.00397|
|Conductivity at 20°C (68°F)||Anealed 101% IACS min|
|Temperature °C (°F)||Thermal expansion 10 -6/K (10 -6/°F)|
|20-500 (68-932)||17.0 (9.4)|
|Temperature °C (°F)||100 (212)|
|W m-1 K-1 (Btu h-1 ft-1 °F-1)||391 (226)|
|Temperature °C (°F)||20|
|kJ kg-1 K-1 (Btu lb-1 °F-1)||0.385 (0.092)|
|Melting Point °C (°F)||1083 (1981)|
|Specifications||ASTM B170, 1, 2, 3, F-68, 272-grade 1 and 2|